← All open roles
Engineering · Neybo · AI companion device for kids

Firmware Lead Engineer

Lead firmware build and integration — take software from multiple hardware modules and turn it into one stable, production-ready Linux/ARM image.

Remote-friendly
Position summary

You lead firmware build and integration for the device - taking software from multiple hardware modules and turning it into one stable, production-ready Linux/ARM image.

Full-time, permanent role on the core team. You work end-to-end with hardware and product - from board bring-up through production units and factory test support.

You own the build system and the integration decisions: how subsystem software comes together, how the image gets built and versioned, and how it moves from a working prototype to something manufacturing can flash at scale.

Key responsibilities

Firmware build and integration

  • Build and maintain the embedded Linux firmware for the ARM-based consumer device: custom kernel, device tree and bootloader (U-Boot or equivalent), root filesystem, and general Linux distro selection and support.
  • Integrate software from multiple hardware component vendors (SoC, wireless, audio, sensors, storage - as part of the whole device) into one coherent, testable firmware build.
  • Own the build system and CI: stable builds, versioning, artefact management, and a clear path to ship updates after launch.
  • Set up and maintain cross-compilation toolchains and BSP integration (Yocto, Buildroot, or vendor SDK) for the target ARM SoC.
  • Support hardware validation: flashing production images, factory test hooks, debug tooling, and issue triage with the HW team.
  • Optimize / tune-up the overall system performance (CPU clock/throttling, DRAM clock, scheduler etc)
  • Coordinate with driver and application engineers to align interfaces between subsystems and keep the integrated image stable.
Required qualifications
  • 7+ years in embedded Linux or firmware engineering, with at least one or two shipped consumer or IoT products where you owned build and integration end-to-end.
  • Deep hands-on experience with embedded Linux on ARM: kernel configuration, device tree, bootloader (U-Boot or equivalent), and root filesystem build.
  • Experience with a build system such as Yocto or Buildroot, and with vendor BSPs/SDKs for ARM SoCs.
  • Strong C/C++ and shell/Python scripting for build tooling, integration testing, and automation.
  • Track record integrating software from multiple hardware modules (radios, audio, sensors, storage) into one stable image.
  • Production readiness: built and supported images for factory flashing, production test procedures, and field debugging on real hardware.
  • Build and CI for firmware: reproducible builds, artifact versioning, and a path to ship OTA or manual updates after launch.
  • Secure FW development 101: security hardening best practices and CVE testing procedures
  • Comfortable reading schematics and datasheets, and working directly with hardware engineers.
  • Portfolio required: repos, binaries, or case studies showing firmware builds you owned - target platform, build system, and what shipped.
  • English B2+: code, docs, vendor communication, and team sync.
Preferred qualifications
  • Smart devices, wearables, or consumer IoT hardware.
  • Wi-Fi/BLE bring-up, pairing, and reconnect behavior on constrained hardware.
  • OTA updates with rollback and A/B or safe-fail behavior.
  • Experience with secure boot, image signing, or manufacturing provisioning flows.
  • Startup, venture studio, or 0-to-1 hardware product experience.
Technology stack
  • Languages: C, C++.
  • Embedded Linux: Yocto or Buildroot, U-Boot, device tree, kernel configuration for ARM SoCs.
  • Interfaces: I2C, SPI, UART, GPIO; vendor SDKs for the target SoC.
  • Practices: Git, Gerrit, firmware CI, JTAG/SWD debug, logic analyzer and oscilloscope debug/testing of the target HW.
  • Tooling: AI-assisted IDE (Cursor or similar) for docs, tests, and codegen under your review.
Success metrics
  • Embedded Linux/ARM image built, integrated, and stable across all hardware modules on target hardware.
  • Production-grade image delivered with support for hardware test and manufacturing flows.
  • Build system and CI in place with reproducible builds and a documented update path.